J-kem enig
J-KEM Enig: reliable, solderable and bondable final finish
J-KEM Enig is an electroless nickel-immersion, gold-plating process engineered to give PCB producers higher yield through consistent performance.
Overcomes the drawbacks of traditional processes
Specially-formulated electroless nickel eliminates all traditional problems associated with the Enig process, e.g. extraneous plating, skip plating and black pads. The ionic activator gives a selective plating of the copper surface. J-KEM Ni 6000’s relatively low operating temperature (80 – 85°C) automatically gives a non-etch effect that protects the solder mask and results in increased nickel rates as well as reduced phosphorus content.
J-kem enig
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Excellent solderability and bondability
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No skip plating, designed with black pads reduction formulation
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No extraneous plating
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Mid-phosphorous electroless nickel with corrosion protection without jeopardizing solderbility and bondability
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Solder mask friendly process
Enig process sequence
Step | Product | Time | Temperature |
---|---|---|---|
1 | ACID CLEANER 7320 | 5 min | 45°C |
2 | Rinse | ||
3 | MICROETCH 7227S | 2 min | 25°C |
4 | Rinse | ||
5 | CATALYST Pd 600 | 5 min | 30°C |
6 | PRE / POST-DIP | ||
7 | Rinse | ||
8 | ELECTROLESS Ni 6000 | 15 – 30 min | 80 – 85°C |
9 | Rinse | ||
10 | IMMERSION Au 3000 | 10 – 15 min | 80 – 85°C |
11 | Au DRAG-OUT | 1 – 2 min | |
12 | Hot rinse | 60°C | |
13 | Final dry |