+46 859 035 490 jkem@jkem.se

J-kem enig

J-KEM Enig: reliable, solderable and bondable final finish

J-KEM Enig is an electroless nickel-immersion, gold-plating process engineered to give PCB producers higher yield through consistent performance.

Overcomes the drawbacks of traditional processes

Specially-formulated electroless nickel eliminates all traditional problems associated with the Enig process, e.g. extraneous plating, skip plating and black pads. The ionic activator gives a selective plating of the copper surface. J-KEM Ni 6000’s relatively low operating temperature (80 – 85°C) automatically gives a non-etch effect that protects the solder mask and results in increased nickel rates as well as reduced phosphorus content.

J-kem enig

  • Excellent solderability and bondability

  • No skip plating, designed with black pads reduction formulation

  • No extraneous plating

  • Mid-phosphorous electroless nickel with corrosion protection without jeopardizing solderbility and bondability

  • Solder mask friendly process

Dense, fine-grained, even-coated 24-carat Au 3000 deposit.

10 K mag of mid-phosphorous
Ni 6000 deposit.

Au wire Ball-Stitch bonding test after 100°C/95% +/- 5 r.H for 8 hr giving
average 5.18 g.f.

Enig process sequence

Step Product Time Temperature
1 ACID CLEANER 7320 5 min 45°C
2 Rinse
3 MICROETCH 7227S 2 min 25°C
4 Rinse
5 CATALYST Pd 600 5 min 30°C
6 PRE / POST-DIP
7 Rinse
8 ELECTROLESS Ni 6000 15 – 30 min 80 – 85°C
9 Rinse
10 IMMERSION Au 3000 10 – 15 min 80 – 85°C
11 Au DRAG-OUT 1 – 2 min
12 Hot rinse 60°C
13 Final dry