J-kem enig

J-KEM Enig: reliable, solderable and bondable final finish

J-KEM Enig is an electroless nickel-immersion, gold-plating process engineered to give PCB producers higher yield through consistent performance.

Overcomes the drawbacks of traditional processes

Specially-formulated electroless nickel eliminates all traditional problems associated with the Enig process, e.g. extraneous plating, skip plating and black pads. The ionic activator gives a selective plating of the copper surface. J-KEM Ni 6000’s relatively low operating temperature (80 – 85°C) automatically gives a non-etch effect that protects the solder mask and results in increased nickel rates as well as reduced phosphorus content.

J-kem enig

Excellent solderability and bondability
No skip plating, designed with black pads reduction formulation
No extraneous plating

Mid-phosphorous electroless nickel with corrosion protection without jeopardizing solderbility and bondability
Solder mask friendly process

Dense, fine-grained, even-coated 24-carat Au 3000 deposit.

10 K mag of mid-phosphorous
Ni 6000 deposit.

Au wire Ball-Stitch bonding test after 100°C/95% +/- 5 r.H for 8 hr giving
average 5.18 g.f.

Enig process sequence

Step	Product	Time	Temperature
1	ACID CLEANER 7320	5 min	45°C
2	Rinse
3	MICROETCH 7227S	2 min	25°C
4	Rinse
5	CATALYST Pd 600	5 min	30°C
6	PRE / POST-DIP
7	Rinse
8	ELECTROLESS Ni 6000	15 – 30 min	80 – 85°C
9	Rinse
10	IMMERSION Au 3000	10 – 15 min	80 – 85°C
11	Au DRAG-OUT	1 – 2 min
12	Hot rinse		60°C
13	Final dry