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J-Plate

Electrolytic plating: astonishing throwing power at your disposal

Our four leading electrolytic plating baths fulfill all your demands and solve every problem associated with modern board designs. Outstanding throwing power is common to all.

J-KEM DC J-Plate series plates the most complex and demanding designs.

J-Plate Cu 90H

Plates blind and micro-vias

J-Plate Cu 90H is an acid copper-plating bath designed specially for boards with complex and demanding designs. Designed for optimum throwing power over the whole current density window all the way down to 0.5 A/dm2, it dramatically improves the plating of blind and micro-vias.

J-Plate Cu 90H gives a copper deposition of the highest possible ductility; a very uniform deposit with a fine-grained equiaxed structure. Extremely good elongation and high ductility make J-Plate Cu 90H ideal for flex and flex/rigid applications.

J-plate

Cu 90H

  • Produces fine-grained amorphous copper

  • Excellent physical properties

  • Improved leveling

  • Excellent DC distribution

  • Good ductility and outstanding thermal check resistance

J-Plate Cu 400

Hole-wall to surface distribution close to 1:1

J-Plate Cu 400 is specially made to combine with direct plating processes (J-KEM System-S/ViaKing). As a high-speed, bright acid copper plating process, it produces highly leveled smooth deposits on both high and low current density levels. When operated under optimum conditions, its high throwing power can produce a hole-wall to surface distribution close to 1:1.

J-plate

Cu 400

  • Extremely wide operating window

  • Highly leveled deposition

  • Maximum resistance to contamination

  • Very economical in use

J-Plate PPR Cu 8002

Plates the most complicated board designs

J-Plate PPR Cu 8002 is an acid copper bath specially designed for pulse periodic reverse plating of the most complicated board design. Its astonishing throwing power gives an outstanding surface distribution and hole-wall to surface distribution as close as possible to 1:1. Furthermore, the thickness distribution in the hole is more than three-times better than standard DC.

J-Plate PPR Cu 8002 plates extremely ‘irregular’ patterns with the same perfection as it handles completely regular patterns, the latter a task that J-Plate Cu 90H also accomplishes with ease. A further advantage of panel plating with pulse periodic reverse plating is that over-plating at the edge is eliminated. In addition, the current density values that can be achieved are much higher, which increases productivity.

J-plate

PPR Cu 8002

  • Two-component replenisher

  • Superior throwing power

  • Operates in horizontal and vertical applications

  • Outstanding surface distribution

  • Increased yield and productivity in micro-via production

J-Plate Cu 920 BVF

Fills blind micro-vias, deposits normal copper thickness

New J-Plate Cu 920 BVF is already a production-proven process for simultaneously plating through holes and filling blind micro-vias. In HDI technology, the electrical contact between two adjacent PCB layers is established using blind micro-vias.

To achieve a very low contact resistance, high reliability and high integration density, the blind micro-vias are electroplated with copper. The quality of the copper deposit is critical for the performance and the reliability of the whole electronic device.

The electro-deposition of copper thus plays a key role in the production of modern electronic devices. J-KEM has consequently developed a unique product – J-Plate Cu 920 BVF – that can be utilized for filling blind micro-vias while at the same time depositing normal copper thickness on the copper surface.

J-plate

Cu 920 BVF

  • Excellent blind micro-via filling

  • Very good through-hole plating

  • Stable blind micro-via filling quality

  • Uniform filling:

  • Uniform filling: performances in vias up to 1:1 ratio

  • Excellent surface distribution performances < +/- 10%

  • IC substrate reliability tests passed: solder ball shear test, elongation test, thermal stress test

  • Suitable for direct metallization processes (System-S, ViaKing)

  • Suitable for standard rack and vertical continuous plating lines

  • Optimal for SAP technology.

  • Capable of meeting MIL-PRF-55IIOH and BS-9760

  • Complete analytical control

J-Plate Cu 920 BVF produces perfect stacked build up designs and perfect filled via holes.

J-Plate Cu 90H

Throwing power value at different temperatures

Cu²+ = 19 g/l
H2SO4 = 185 g/l
Current = 25 ASF / 2.7 A/dm²
Board thickness = 1.6 mm
Hole diameter = 0.3 mm

Bath temp. (°C) Throwing  power (%)
20 90.6
22 88.9
24 88.3
26 87.5
28 86.7
30 85.9

J-Plate Cu 90H

Throwing power value at different current densities

Cu²+ = 19 g/l
H2SO4 = 185 g/l
Temperature = 22°C
Board thickness = 1.6 mm
Hole diameter = 0.3 mm

Current density Throwing  power (%)
10 93.2
20 90.1
30 88
50 85.3
50 83.1

J-Plate Cu 90H

Throwing power value at different copper concentrations

Temperature = 22°C
Current = 25 ASF / 2.7 A/dm²
Board thickness = 1.6 mm
Hole diameter = 0.3 mm

Cu conc. Throwing
power (%)
15 89.9
17.5 88.7
20 87.8
22.5 87.1
25 86.2

J-Plate Cu 90H

Throwing power value at different aspect ratios

Aspect ratio Throwing power (%)
1:5 90 – 95 %
1:10 78 – 86 %

Current density = 20 ASF / 2.1 A/dm²
CuSO4 x 5 H2O = 70 g/l
H2SO4 = 210 g/l
Temperature = 20 – 22°C

J-Plate Cu 90H

Ductility (elongation) and tensile strength

Sample Thickness (μm) average Tensile strength kgf/mm² Ductility (%)
1 53 34.1
35.0
30.1
28.6
2 48 33.8
33.6
26.6
27.4
3 50 33.9
34.3
29.1
29.8

CuSO4 x 5 H2O = 85 g/l
H2SO4 = 190 g/l
Temperature = 22 – 24°C

Sample 1 = 35 ASF / 3.8 A/dm² / 75 minutes
Sample 2 = 25 ASF / 2.7 A/dm² / 100 minutes
Sample 3 = 20 ASF / 2.1 A/dm² / 120 minutes

Sample: Copper foil plated on polished stainless steel. Two strips were analyzed for every sample.