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technologies

Multilayer technologies

OXIDE REPLACEMENT: TOP BOND

CONDITIONER 7876
Creates a perfect copper surface in the final stage of the TOP BOND process.

PRE-DIP 7877
Specially formulated to prolong the lifetime of Promoter 7878.

PROMOTER 7878
Revolutionary new oxide replacement chemistry formulated to promote superior peel strength of PCB inner layers. Suitable for immersion or flood conveyer application.

CLASSIC OXIDE TECHNOLOGY

CLEANER 7310
Sprayable acid cleaner prior to inner-layer oxidation.

CLEANER 7320 
High-performance acid cleaner prior to inner-layer oxidation.

MICROETCH 7227 S 
Microetch to obtain a suitable copper surface.

MICROETCH 7228 P 
Microetch specially designed to obtain superior adhesion.

BLACK OXIDE 7355 
Ready-made, low-temperature process to create a dense black oxide with crystal morphology for inner-layer copper.

BROWN OXIDE 7330
Low-temperature process to create a dense brown oxide with crystal morphology for inner-layer copper.

REDUCER 7340
Produces a reduced oxide and protective coating for brown or black oxide.

OXIDE REMOVER
Completely removes the oxide layer from copper surfaces.

DESMEARING TECHNOLOGY

SWELL 7102H
Biodegradable solvent-based sweller for horizontal application.

SWELL 7100
Solvent sweller that eliminates the use of plasma and chromic acid. Low temperature and extremely efficient swelling.

DESMEAR 7110H
Gives the dielectric a micro-roughened surface. Supplied in two concentrates. Works within a wide temperature window.

DESMEAR 7110
Removes drill smear and debris. Textures the resin surface for optimum plating result.

NEUTRALISER 7120
Non-chelated manganate neutralizer that uses hydrogen peroxide/sulphuric acid as reducing agent.

NEUTRALISER 7135
Non-etching hydrazine-free permanganate reducer. Specially designed to eliminate delamination/pink ring.

NEUTRALISER 7135 L
New formulation permanganate reducer that neutralizes and dissolves oxide species of manganese to leave a residue-free surface.

Plating-through-holes technology

ELECTROLESS COPPER: PERFEKTO

CONDITIONER PAC 705
Acidic cleaner conditioner used to prepare PCBs for hole-through plating. Unique formulation leaves a uniform positive charge over the whole dielectric surface.

CONDITIONER PAC 714
Alkaline cleaner/conditioner used to prepare PCBs for hole-through plating. Superior back lights, especially where glass fibers are exposed.

CONDITIONER ACS 2060
Mild alkaline cleaner/conditioner for the Perfekto ACS alkaline catalyst process. Very efficient in conditioning both epoxy and glass-fiber.

PRE-DIP PPD 730
Pre-dip used prior to activator. Increases the receptivity of the substrate. Maintains and protects activator POA 735.

PRE-DIP ACS 2073
Increases receptivity of the hole-wall. Pre-dip in Perfekto ACS alkaline activator process.

ACTIVATOR POA 735
An organo-metallic colloidal solution specially formulated to activate circuit boards prior to electroless deposition of copper. The unique formulation covers the substrate with a smooth, uniform catalyst layer even at extremely low concentrations of palladium.

ACTIVATOR POA 736
Catalyst for electroless copper deposition on non-conductors. Specially-formulated to activate circuit boards prior to Perfekto electroless copper baths.

ACCELERATOR PAR 745
A unique two-component formulation for maximum copper bonding in advanced PCB production. Removes tin from adsorbed colloidal palladium leaving highly-catalytic metal site on the hole-walls.

CATALYST ACS 2074
Fundamental step of the Perfekto ACS process. Alkaline activator primarily responsible for superior coverage of subsequent electroless copper deposits.

ACCELERATOR PAA 748
Alkaline-accelerator specially designed for use with Perfekto activators. Compared to conventional accelerators, it results in perfect, non-compromised coverage of exposed glass-fiber.

REDUCER ACS 2075
Post-sensitizing solution in Perfekto ACS process. Releases catalytic sites on surface.

PERFEKTO PEC 550
Real low-built, pink deposition with a dense, fine-grain structure. Outstanding production stability in high and low loading gives excellent production economy.

PERFEKTO PEC 660
Controlled-initiation, cyanide-free, medium-build electroless copper. Remarkably stable and easy to control. Pink deposit has a dense, fine-grain structure.

PERFEKTO PEC 670
Controlled-initiation, EDTA-based medium-build electroless copper. Remarkably stable and easy to control.

PERFEKTO PEC 760
High-performance, cyanide-free medium/high-build electroless copper. Controlled initiation improves copper deposit adhesion.

PERFEKTO PEC 770
Controlled-initiation, EDTA-based high-build electroless copper. Remarkably stable and easy to control.

DIRECT PLATING TECHNOLOGY: SYSTEM-S

CONDITIONER DS 200
Single-component degreaser and conditioner with strong cleaning capacity. Suitable for double-sided production.

CONDITIONER DS 270
Low-concentration, single-component degreaser with high conditioning power for HARB multi-layer production.

CONDITIONER DS 280 H
Two-component conditioner for horizontal direct metallization.

PRE-DIP DS 400
Ready-made pre-dip prior to catalyst. Formulated to increase the receptivity of Activator DS-500 on the epoxy-resin substrate.

ACTIVATOR DS 500
Unique three-metal colloidal palladium catalyst. Extremely stable with unique properties. Gives the best conductivity on the market.

INTENSIFIER DS 650
Converts colloidal palladium into a mono-molecular film of metals. Enhances conductivity, plating performance and inner-layer adhesion.

SETTER DS 800
Fixes the metallic layer to the hole-wall and cleans the copper surface by removing the System-S deposit.

REDUCER DS 880
A powder that ‘sets’ the catalytic film when mixed with acid.

ANTI-TARNISH DS 850
Optional oxidation inhibitor of copper. Treated board retains long-term conductivity and plating properties.

Direct plating technology: ViaKing

CONDITIONER DS 280 VK
Alkaline conditioner that cleans the copper surface and conditions the hole-wall surface to prepare adhesion of ViaKing Conductivator.

CONDUCTIVATOR 202
Mildly alkaline-conductive colloid dispersion formulated from bound graphite. Graphite, together with a formulated binder, exists as an anionic charged particle very attracted to the charge left on the hole-wall by Conditioner 201.

MICROETCH 7227 S
The ViaKing microetch. Maintains etch rate between 0.25-0.35 µm. This step removes ViaKing coating from all copper surfaces, including inner-layer interconnect faces.

ANTI-TARNISH PAT 790
Optional step to ensure maximum protection against copper oxidation during long-term storage prior to dry film lamination and/or electrolytic copper plating after the ViaKing process.

Electrolytic plating

J-PLATE

ACID CLEANER DS 900
High-performance acid cleaner prior to electroplating. Low-foam, easy-rinsing. Suitable for direct plating System-S and Perfekto.

ACID CLEANER DS 950
Extra high-performance acid cleaner prior to electroplating. Low-foam, strong- clean, easy-rinsing. Suitable for direct plating ViaKing and Perfekto.

MICROETCH DS 300
Stable ammonium-free mild microetch. High capacity for copper with consistent etch rate. Suitable for direct plating System-S.

J-PLATE CU 400
Easy-to-control, one-component bright acid copper bath that creates a highly ductile plated copper. High through-hole distribution and exceptional throwing power.

J-PLATE CU 90H
New, modern two-component acid copper specially designed to produce a bright, uniform copper deposition with superior throwing power and distribution performance. Formulated for high aspect ratio PCB production. 

J-PLATE

J-PLATE PPR CU 8002
Revolutionary two-component acid copper for plating at high-current density under pulse periodic reverse current. Superior throwing power plus extremely uniform thickness distribution. Extremely good metallurgic properties and ductility.

J-PLATE CU 920 BVF
Three-component acid copper specially designed for via filling applications in advanced PCB designs by using insoluble anodes in direct current applications.

J-PLATE SN 800
Pure satin tin sulfuric acid-based agent that protects the copper surface during the etching process. Excellent coverage is maintained across a wide current density range.

J-PLATE TL 900
A high-throw, tin-lead plating bath specially formulated to produce a level, uniform deposit with excellent solderability.

Strippers

FILM STRIPPERS

FILM STRIPPER 7400
Additive for butyl glycol-based stripper.

FILM STRIPPER 7411
Single NaOH-based additive. Economical stripper.

FILM STRIPPER 7422
High-performance, single-part alkaline stripper. For applications where a solvent cannot be used.

FILM STRIPPER 7430
Super-concentrated stripper for removing alkaline-soluble protective film protecting the copper surface during etching on fine-pitch PBCs.

FILM STRIPPER 7450
Rapid stripper for fine-line boards. Use for both immersion and spray applications.

STRIPPER 7460
Effective stripper for fine-line boards. Easily dissolves dry film between over-plated, fine-line tracks.

ANTI-FOAM 1600
Non-silicone efficient anti-foam perfect in strippers and developing.

TIN/LEAD AND TIN STRIPPERS

STRIPPER 7681
Fluoboric-peroxide single-step immersion stripper for tin/lead.

STRIPPER TL-501
Fluoboric acid stripper for rapidly stripping tin or tin-lead from copper substrates.

STRIPPER TL-502
Acidic stripper for tin and tin-lead alloy. Leaves a thin copper-tin inter-metallic layer.

STRIPPER TL-503
Acidic stripper for second-stage stripping after TL-501 or TL-502.

STRIPPER TL 510
Ready-made, single-stage nitric acid- based stripper with high tin/lead capacity and minimal attack on copper.

STRIPPER 510 X
Concentrate of 510. A low-cost tin/lead stripper.

STRIPPER 511
Fast single-step stripper of tin or tin-alloy over copper. Spray application. Can also be used as second step after TL-501 or TL-502.

STRIPPER TL 514
High-performance, single-step chemical stripper for removing tin with a minimum attack on copper.

STRIPPER TL-516
Low-sludging, single-step tin stripper for spray application.

Surface finishing

IR FUSING AND HASL

HASL FLUX 7510
Water-soluble, bromine-free biode­gradable, low-volatility flux that ensures consistent results and quality.

HASL FLUX 7516
Water-soluble, biodegradable flux designed specially for SMD boards.

HASL FLUX 7518
Water-soluble flux with low acid content. Reduces corrosion and ionic contami­nation.

HASL FLUX 7532
Water-soluble flux with a low odor formulation suitable for SMD boards.

HASL FLUX 7545
High-performing, water-soluble, bromine-free biodegradable and totally free-rinsing flux that gives exceptional solder mask protection and activates the smallest SMD pads.

HASL FLUX 7546
Water-soluble, biodegradable flux with unique properties. Low volatility ensures consistent results with low maintenance.

HASL FLUX 7548
Low-acid flux that eliminates white solder mask residues. Low odor, consistent results and low maintenance.

HASL FLUX 7552
Water-soluble, biodegradable flux specially made for lead-free HASL.

HASL FLUX 7575
Best in Test. Probably the best lead-free flux on the market. Reduces ionic contamination. Economical to use. Easy to rinse.

IR FLUX 7590
Infra-red reflow flux that works well on side walls of tracks and on large land areas.

CLEANER IR
Cleaner to remove flux residue following IR or HASL. Suitable for spray or immersion.

ELECTROLESS NI / IMMERSION AU

ACTIVATOR PD 600 
Ionic palladium activator prior to electroless nickel. Gives complete catalysation of copper surface with no activation of non-conductors.

ELECTROLESS NI 6000
Stable, semi-bright electroless nickel phosphorus alloy gives a corrosion- resistant deposit.

IMMERSION AU 3000
Replenishable immersion gold for a perfect flat solderable gold finish for surface-mount devices.

ANTI-TARNISH

ANTI-TARNISH 7756
Mono-molecular anti-tarnish layer. Perfect as inter-stage anti-tarnish. Acts as an adhesion promoter prior to dry film application. Suitable as a flat solderable finish for one heat cycle.

GOLD PLATING

J-PLATE AU 3022
Au/Co 24 carats acid bath with high output for electronics. Low porosity deposition with high wear characteristics perfect for gold fingers on PCB.

IMMERSION TIN

ACID CLEANER 7000H
The first step in the immersion tin process. Acid solution that removes all copper oxides.

MICROETCH 7020
Used to obtain an optimum copper structure. Promotes adhesion of the organic metal and immersion tin.

PRE-DIP 7050
Unique organic metal eliminates copper diffusion and intermetalic oxidation. Improves solderability and wetability of Sn 7000. Increases catalysis of the immersion tin deposition.

IMMERSION TIN 7050
Protective coating of non-porous, fine-grained structure. Homogeneous layer thickness and excellent surface planarity. Easy to control in horizontal and vertical applications.