+46 859 035 490 jkem@jkem.se

TOP BOND OXIDE REPLACEMENT

Innovative topography modifier:
for modern multi-layer production

Top Bond is an innovative three-step topography modifier and adhesion promoter for modern multi-layer production.

Top Bond RA foil

Top Bond on plated copper

Reduced oxide on HTE foil

Top Bond on HTE foil

CONDITIONER 7876
Special formulation with surface-active additives that work as topography modifiers.

PRE-DIP 7877
Initiates organometallic coating.

PROMOTER 7878
Revolutionary chemistry formulated to enhance higher bond strength and ensure excellent resistance to delamination of multi-layer PCBs.

Top bond

Features

  • Unique surface-active formulation enhances topography modification

  • Super peel strength on high Tg material

  • No pink ring or wedge voids

  • Outstanding thermal resistance on high Tg material
  • Low temperatures
  • Stable result and extremely easy handling
  • Perfect for both vertical and horizontal applications

Top Bond process sequence

Step Process Time
vertical
Temperature
vertical
Time
horizontal
Temperature
horizontal
1 CONDITIONER 7876 3 min 45°C 30 sec 50°C
2 Rinsing
3 PRE-DIP 7877 2 min room temp. 30 sec 25°C
4 PROMOTOR 7878 2 min 35°C 60 sec 40°C
5 Rinsing
6 Drying