TOP BOND OXIDE REPLACEMENT
Innovative topography modifier:
for modern multi-layer production
Top Bond is an innovative three-step topography modifier and adhesion promoter for modern multi-layer production.
Top Bond RA foil
Top Bond on plated copper
Reduced oxide on HTE foil
Top Bond on HTE foil
CONDITIONER 7876
Special formulation with surface-active additives that work as topography modifiers.
PRE-DIP 7877
Initiates organometallic coating.
PROMOTER 7878
Revolutionary chemistry formulated to enhance higher bond strength and ensure excellent resistance to delamination of multi-layer PCBs.
Top bond
Features
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Unique surface-active formulation enhances topography modification
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Super peel strength on high Tg material
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No pink ring or wedge voids
- Outstanding thermal resistance on high Tg material
- Low temperatures
- Stable result and extremely easy handling
- Perfect for both vertical and horizontal applications
Top Bond process sequence
| Step | Process | Time vertical |
Temperature vertical |
Time horizontal |
Temperature horizontal |
|---|---|---|---|---|---|
| 1 | CONDITIONER 7876 | 3 min | 45°C | 30 sec | 50°C |
| 2 | Rinsing | ||||
| 3 | PRE-DIP 7877 | 2 min | room temp. | 30 sec | 25°C |
| 4 | PROMOTOR 7878 | 2 min | 35°C | 60 sec | 40°C |
| 5 | Rinsing | ||||
| 6 | Drying |