TOP BOND OXIDE REPLACEMENT
Innovative topography modifier:
for modern multi-layer production
Top Bond is an innovative three-step topography modifier and adhesion promoter for modern multi-layer production.
Top Bond RA foil
Top Bond on plated copper
Reduced oxide on HTE foil
Top Bond on HTE foil
Special formulation with surface-active additives that work as topography modifiers.
Initiates organometallic coating.
Revolutionary chemistry formulated to enhance higher bond strength and ensure excellent resistance to delamination of multi-layer PCBs.
Top Bond process sequence
|1||CONDITIONER 7876||3 min||45°C||30 sec||50°C|
|3||PRE-DIP 7877||2 min||room temp.||30 sec||25°C|
|4||PROMOTOR 7878||2 min||35°C||60 sec||40°C|